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Title : FABRICATION SYSTEM AND METHOD OF E-PAPER

Status Patented Part Mech/Metal
Conditon Licensing Estimated Cost 0 US$

Summary of the technology
ㅇ This technology relates to a system and method for fabricating e-paper.
ㅇ In general, e-paper was problematic in that particles were accumulated on a barrier rib of a panel upon fabrication and the particles are damaged due to several problems in the convey and control process of the particles.
This technology is provided by lowering the amount of an electric field in regions other than an electrode by forming an insulating layer at the bottom of a stamp other than the electrode so that a particle is adhered to near the electrode to which a relatively high electric field is applied. In particular, this technology is an improved technology which can prevent damage to the particle by removing several problems, which may occur in the convey and control process of the particle by designing the stamp constituting a thin film insulating layer at the bottom of the stamp including the electrode.


Images 1)

e-paper.doc
 

 



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