Title : Method for manufacturing micro-machined switch using pull-up type contact pad
Status
Patented
Part
Elec/ET
Conditon
Licensing
Estimated Cost
0 US$
Abstract
The present invention relates to the manufacture of a semiconductor switch for use in a variety of communication systems, and particularly to the manufacture of a RF micro-machined switch of pull-up type, wherein an electrostatic electrode is used so as to cause the contact pad involved in the operation of the switch to be pulled upward from below.The RF micro-machined switch of pull-up type according to the invention has a high isolation characteristic for shorting and opening the circuit and needs a low driving voltage, so that miniaturization of communication system is possible because a circuit for booting driving voltage is not required within the system. Further, the characteristic of switch is little changed after a long use because the metal composing the contact pad experiences little deformation during operation, whereby the semi-permanent use of switch is possible.The present invention provides a pull-up type RF micro-machined switch, wherein the shorting of the contact pad with the transmission lines is possible with a low DC voltage by altering the conventional pull-down type electrostatic electrode into a pull-up structure and the opening of the circuit is facilitated by the weight of the contact pad by composing the contact pad in a thick metal layer.